ICED19: The 19th International Conference on Engineering Design
Sungkyunkwan University, Creative Design Institute, Seoul, Korea
19-22 August 2013
Papers now available at
It is a great pleasure to inform you that the International Conference
on Engineering Design 2013 will be held from August 19th to 22th in Seoul, Korea.
The organising committee has chosen “Design for Harmonies”
as the main theme of the conference. Seoul, the city of harmonies including
the old and the new, will provide an excellent venue for discussions and
networking on Design for Harmonies, like harmony of products and services,
harmony of culture and technology.
As the first Asia city of ICED series, Seoul will also present diverse harmonies of East and West.
I hope you will join us at the ICED 13 and have fun and excitement together with all the global experts.
ICED 13 Organising Committee
Yong Se Kim,
Conference Chair Sungkyunkwan Univ., Korea
Sang Won Lee,
Assistant Conference Chair Sungkyunkwan Univ., Korea
Yoo Suk Hong Seoul National Univ., Korea
Haeseong Jee Hongik Univ., Korea
Jong Won Kim Seoul National Univ., Korea
Kee-Ok Kim Sungkyunkwan Univ., Korea
Myoun Kim Sungkyunkwan Univ., Korea
Ji Hyun Lee KAIST, Korea
Seong Il Lee Sungkyunkwan Univ., Korea
Chris McMahon Univ. of Bristol, UK
Tom Howard Technical Univ. of Denmark, Denmark
ICED 13 Programme Committee
Udo Lindemann,
Programme Chair Technical Univ. of Munich, Germany
Srinivasan Venkataraman,
Assistant Programme Chair Technical Univ. of Munich, Germany
Chris McMahon Univ. of Bristol, UK
Panos Papalambros Univ. of Michigan, USA
Yong Se Kim Sungkyunkwan Univ., Korea
Sang Won Lee Sungkyunkwan Univ., Korea
ICED 13 Asian Liaison Committee
Koichi Ohtomi Toshiba, Japan
Toshiharu Taura Kobe Univ., Japan
Kikuo Fujita Osaka Univ., Japan
Yukari Nagai Japan Advanced Institute of Science and Technology, Japan
Keiichi Sato Illinois Institute of Technology, USA
Yan Jin Univ. of Southern California, USA & Shanghai Jiao Tong Univ., China
Mitchel Tseng Hong Kong Univ. of Science and Technology, Hong Kong
Cees de Bont Hong Kong Polytechnic Univ., Hong Kong
Chih-Hsing Chu National Tsing Hua Univ., Taiwan
Chun-Hsien Chen Nanyang Technological Univ., Singapore
Ying Liu National Univ. of Singapore, Singapore
Soo-Shin Choi Univ. of Cincinnati, USA
Seung Ki Moon Nanyang Technological Univ., Singapore
Gyuchan Jun Loughborough Univ., UK
Young Mi Choi Georgia Institute of Technology, USA
Sun Kim Abbott, USA & Keio Univ., Japan
Kristin L. Wood Singapore University of Technology and Design, Singapore